Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Assuring you our best, always

3rd Optical Inspection System
ISP3100

ISP3100 is designed to handle lead frames or substrates for visual inspection and yield management after die attach and wire bonding process. It’s equipped with strip mapping system and auto-conversion mechanism for different types of packages. It’s capable to perform physical marking with various types of reject identification module such as puncher, wire breaker, bristle, scriber, inker, laser wire breaker and laser clip bond cutter.
Specifications
  • Designed to handle leadframe or substrate size of max. 300x100mm
  • Auto-conversion module for leadframe package changeover without manual adjustment.
  • Pusher & Gripper with anti-jamming mechanism.
  • Pneumatic clamps to hold leadframe into position during stage movement.
  • Programmable centre support rail for warped leadframe.
  • User-friendly HMI with strip mapping control.
  • Various reject marking module for selection. (inker, scriber, bristle, puncher, wire breaker, laser cutter and etc.)
  • Optional SECS/GEM communication module.
Please contact us for more information