CHAPMAN

  • MP2100

    Specially designed for Wafer Die, Crack/Edge Chip detection, surface measurements and analysis. It can be used as a production tool for inline quality inspection as well as a research and development tool for establishing standards and researching tolerances.


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  • MPT1000

    The MPT1000 utilizes a sophisticated non-contact measurement technology with a focused laser sport on the wafer surfaces. Users can measure structured taped wafers after the backgrind or dicing. This advance wafer measurement system has the capability of measuring both thickness and roughness within the same tool.


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