Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Assuring you our best, always

Electronics X-Ray Inspection
XT V 160

The XT V 160 is specifically designed for use in production lines and failure analysis laboratories. With a precision joystick, system users control the 5-axis sample manipulator. Real-time X-ray allows users to intuitively navigate complex printed circuit boards and electronic components and quickly trace defects. In automated inspection mode, samples can be inspected at highest throughput.

Key Benefits
  • Leading proprietary micro-focus source technology
  • Fast automated component inspection through customizable macros
  • Intuitive joystick navigation drives real-time X-ray imaging
  • 4K Ultra HD display for combined measurement and real-time analysis
  • Low cost of ownership and maintenance with open-tube technology
  • Safety as a design criterion
  • CT and X.Tract (laminography) ready
Specifications
  • Max kv: 160 kV
  • Power rating: 20 W (radiography), 10 W (CT)1
  • X-ray source: Open tube transmission target
  • Focal spot size: 1 µm1 (below 2 W) rising to 10 µm depending on power
  • Defect recognition capability: 500 nm
  • Geometric magnification: 2.5x -2,400x
  • System magnification: Up to 36,000x
  • Imaging system: (Standard) 1.45 Mpixel 12-bit camera with dual field 4"/6" image intensifier
  • Manipulator: 5-axis (X, Y, Z, T, R)
  • Rotate axis: Included
  • Tilt: 0 - 75 degrees
  • Measuring volume: Largest square in single map 406x406 mm (16x16")
  • Absolute max: 711x762 mm (28x30")
  • Max. sample weight: 5 kg (11 lbs)
  • Monitor: Single 4k IPS (3840x2160 pixels)
  • Cabinet dimensions (WxDxH): 1200 x 1786 x 1916 mm  (48.0x71.3x75.4")
  • Weight: 1.935 kg (4,266 lbs)
  • Radiation safety: <1μSv/hr at the cabinet surface
  • Automated inspection: Included
  • Computed Tomography: Optional CT and/or X.Tract
  • Primary applications: Real-time and automated electronics and semiconductor inspection, failure analysis (BGA, μBGA, flip-chip and loaded PCB boards)
Please contact us for more information