Manufacturing Division - Creden

DIS8000 designed to handle frame wafer after the wafer dicing process to process to inspect for the defect that is observable prior to dicing and also die defect resulted after dicing process. It's equipped with two type of defect identifications method namely inking on the defective die and a wafer map that contains the location of the defective die with classification. The system capable of performing wafer backside inspection.

ISP3100 designed to handle lead frame or substrate for visual inspection and yield management after die to attach and wire bonding process. It's equipped with strip mapping system and auto-conversion for a different type of package. It's capable of performing physical marking with various type of reject identification modules such as puncher, wire breaker, bristle, scriber and inker.

WHS300G designed for wafer transferring, splitting, merging or flipping 6" and 8" wafer from the input cassette to the output cassette in batch mode. Input cassette type is SEMI standard open cassette with 26-slot, 25-slot and 13-slot. Four load ports available with three inputs load ports and one output loaad port. The system equipped with high accuracy reflective sensor for wafer protrusion detection.

Creden’s SM1000 Strip Mapping Defect Management System is a TCP/IP networked communication of strip mapping between machines in an efficient, prompt and error-free manner. This enables automated recall of reject maps for use in all processes without operator’s intervention. It’s able to manage and control strip IDs and provide unique ID to “strip-ID laser marker” for 2D matrix code marking. Registration of strip IDs into the map database after verification. It’s compliant to SEMI G84 standards.

NIM1100 designed to perform pogo pins insertion process. Basically, it consists of 4 modules which are the singulator module, orientation checker module, buffer module and nozzle module. It's equipped with a dual camera system for more efficient calibration, double purge features to reduce pin missing and false nozzle jam alarm. The system consists of key lock switch to disable the start and reset buttons function for safety purpose when the user is away from the machine.


WIS8000 designed to handle 8" and 12" wafer for visual inspection using high power metallurgical microscope. Wafer carrier type: 12" FOSB, 12" FOUP and 8" SEMI standard open cassette (SEMI standard). System equipped with 2 FOUP load ports, macro and micro inspection  together with wafer mapping system. Clean room ATM robot integrated with single Fork-type aluminum end effector to hold wafer at its back surface by vacuum suction.

PTS-800 is a single axis high resolution precision tilt measurement system that measures inclination of any moving platform or stages within a system. Measurements can be made either absolute (one sensor) or relative (paired sensors). PTS-800 comes with a user friendly GUI and the simplicity of a USB plug-and-play connection. It comes with high accuracy and outstanding repeatability, insensitive to vibration and excellent shock durability. It is also suitable for wet process.

LSI1000 is designed to perform the laser mark on lead frames and substrates. This system can be applied to either 2D Matrix Code marking or package marking on lead frames and substrates. It’s also equipped with lead frames and substrates orientation checker, post mark quality check station and post mark cleaning station with air blower.

The main purpose of DHS8000 system design is to replace labour force and reduce the faulty that might occur during the process of placing the sticker label (wafer id) on frame wafer by the user. DHS8000 consists of 2 main parts as it's function which is OCR reader and barcode printer. The wafer ID printed on the wafer will be read by OCR. The system will then convert the wafer ID into barcode format and printed it on a sticker label and place it on the wafer tape.

WHS8000 is designed with 2 load ports and is upgradeable to 3. It is configurable to handle 300mm wafer in FOUP or FOSB, and 200mm wafer in the open cassette without conversion. The optional OCR vision system will read the wafer ID and communicate with the host computer for its sorting destination. Alternatively, there are other direct sorting methods which are programmable by the user. This machine uses Rθ robotic arm to ensure fast and precise handling.