Material & Engineering Division - QAM

The TS-PRO is a very unique automated tape attaching machine designed to solve issues caused by current pre-tape method(s).

The advantages of the machine includes:

This high performance auto molding machine is able to meet market trend, which requires application to the  lead frame and high density items. SP series 80 ton/press machine and 120 ton/press machine's mold and conversion kits are able to use for 170 ton/press machine. The machine size is compact for space-saving.

Teikoku UV Irradiation equipment is designed with simplicity in mind for greater MTBF and MTTR for a lower cost of ownership. The UV intensity and exposure is controlled in real time and it automatically adjusts itself by providing proper exposure dosage limits. The dosage limits can be set in recipe control.

Thin wafer handling capability of Teikoku Wafer Mounting equipment are top performers in the industry. With the option of thin wafer handling, special end effector, range of thin, ultra thin and warped wafers is a major plus for our tools.

Teikoku De-taper is equipped with the capability to handle thin and warped wafer up to 10mm. The machine is good for high bump (300µm) wafer detaping with the special features:

The Teikoku Tape Laminator provides two methods for cutting tapes to best match either blade cut or laser cut. Recipe controlled heat option provides tape application parameter settings for a wide variety of tape vendors. Vacuum lamination is available for NCF lamination. This works well on wafers with topography such as Flip Chip and TSV process wafer.

Other than providing high quality bare copper wires as raw materials, TAYA have also began research and development of semiconductor bonding wires since 2003. Products includes bare Cu wire, PdCu wire and AuPdCu wire. Pure Cu bonding wire is applicable to the assembly of power and discrete ICs. AuPd and Pd planted bonding wire is applicable to the assembly of various IC products and LED. TAYA copper wires produces better performance of workability, bondability and better lifetime for capillaries.

Zirco Blast Deflash Media is designed specifically for deflashing non-toxic contamination. It is reusable and works on all substrates. It is also applicable to deflash the mold residue for semiconductor discrete packages.

With carefully selected diamond grits and bonding matrix, the Silicon Wafer Back Grinding Wheel of SHINHAN DIAMOND has achieve superior quality. Variety of pores are formed through our creative process making it possible to have grinding damage minimized. SHINHAN DIAMOND is excellent for thin wafers (<100µm). It achieves low surface damage. For normal wafer, productivity increases with good grindability, tool life and price.

Adamant Ceramic Capillaries are manufactured by our Injection Molding Technology. It achieves excellent concentricity property. This quality reduces the hours of operation significantly at the time of replacement due to the elimination of alignment.

A longer capillary life span and a higher wear resistance has been achieved by using Zirconia Toughed Alumina Ceramic. It has a stronger hardness than the standard Alumina Ceramic.

Dummy wafer is mainly used for experiment and test. They are different from product wafers. Reclaimed wafers are mostly applied as dummy wafers. Dummy wafers are used in production device to improve safety in the beginning of production process. They are also being used for delivery check and evaluation of process form. Size and thickness are import criterias in selecting dummy wafers.

A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components. With greater diversity and higher quality in chips, dicing tapes also require advanced technology. Elegrip dicing tape is used widely in a variety of applications including silicon and GaAs semiconductors (compound semiconductors), encapsulated package substrates, ceramics, glass, and crystals.

Back grinding tape is used to protect the circuit surface from damage by foreign matter, chipping, cracking and contamination during back grinding process. With developments of jumbo-sized and thinned wafer and high bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer, and (3) easiness of peeling. Elegrip BG tape meets these requirements.