Material & Engineering Division - QAM

  • Adjustable removing speed
  • Adjustable removing angle
  • Thin wafer handling
  • Inline UV Irradiation System

The UV tape removal feature provides Auto UV Intensity Calibration.

Model / Specs / Application

Wafer Sizes

300mm, 200mm, 150mm

Throughput

40UPH (normal wafer)

20UPH(normal wafer)

Load/Unload

Max 1 magazine, slot to slot operation

UV System

Ushio UV-152 Metal Hydride

Irradiation Accuracy

±15% at frame area

Dimension

1250(W) x 1250(D) x 1800(H)mm