Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Assuring you our best, always

Post Wirebond Inspection System
ISP5000V

High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
Specifications
  • Designed for Leadframe or substrate with a strip size of 300mm x 100mm.
  • Pusher and gripper mechanism with an anti-jamming mechanism for leadframe handling.
  • Pneumatic clamps to firmly hold the leadframe during XY stage movement.
  • Automatic conversion accommodate different leadframe size.
  • Programmable centre support mechanism for warped leadframe.
  • High-speed camera system with the global shutter and stroboscopic control.
  • Cognex based image processing algorithms.
  • Defect mapping with a re-callable image for verification.
  • Various reject identification module for selection.
  • Optional SECS/GEM communication for strip map and recipe transfer.
Please contact us for more information