Product

Model / Specs / Application

Applications

Thermal Imagining

EUV Mask

Magnetic Tunnel Junctions

Interference coating Rugate filters

High-K Materials

Optoelectronic Materials

Superconducting Materials

Uncooled IR sensors

Spin Valves/AMR/GMR/TMR

Specifications

6” and 8” wafer processing

Multiple processing modules on a robot and cassette front end

Can accommodate up to three (3) processing modules

Advanced wafer management system

Excellent MTTR / MTBF performance

Reactive and non-reactive sputtering and etching

Advanced process control

Highest performance thin film technology

Technology (modules)

Ion Beam Etch (IBE)

  • Dry Etching
  • Reactive Ion Etching (RIE)
  • CAIBE capability
  • Thickness monitor optional

Ion Beam Sputtering

  • Metal and reactive sputtering

Biased Target Sputtering ™

  • High rate Metal sputtering
  • Reactive sputtering
  • Compositional Nano-technology ™

Z-Flex – Etch and dep combination module

Integration

Full computer control

Profibus distributed architecture

SECS / HSMS

Fabguard integration

CE certified

Clean room bulkhead installation