Product

Model / Specs / Application

Applications

Magnetic research

TMR and GMR applications

FINFET and advanced memory development

Specifications

4 Sputter targets

Ion Beam Etching capability

Single wafer load lock system or wafer handoff via robot interface

High volume pumping system

Several options in ion beam source size and output

ESD compliant

Modular design

Maintenance friendly with impressive MTTR/MTBF

Technology (modules)

Ion Beam Etch (IBE)

  • Dry Etching
  • Reactive Ion Etching (RIE)
  • CAIBE capability

Ion Beam Sputtering

  • Metal and oxide
  • Encapsulation

Biased Target Sputtering ™

  • High rate Metal sputtering
  • Reactive sputtering
  • Low defect high performance thin films

Integration

Full computer control

Profibus distributed architecture

SECS / HSMS

CE Certified

Clean Room Ball installation