RIGAKU

  • AZX400

    Rigakus unique AZX400 sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer was specifically designed to handle very large and /or heavy samples. Accepting samples up to 400mm diameter, 50 mm thick and 30kg weight, this system is ideal for analyzing sputtering targets, magnetic disks, or multilayer film metrology or elemental analysis of large samples.


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  • MFM310

    The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultra thin single-layer films to multilayer stacks.


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  • TXRF V310, 310Fab, 310e

    Wafer surface contamination monitoring system for wafer-fab process (cleaning, litho, etch, ashing, TF, etc) Sweeping TXRF Enables mapping of contaminant distribution over entire wafer. ZEE-TXRF enables measurements up to wafer zero edge exclusion. BAC-TXRF enables automated non-contact flipping of 300mm wafers from front-side to back-side for TXRF measurements. Capable to import measurement coordinates from defect inspection tools for follow-up analysis.


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  • WDA-3650

    The WDA-3650 X-ray fluorescence spectrometer for thin eveluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film composition, and element concentration with new functions and a low-COO design.


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