Semiconductor

  • MAT1207BW

    The MAT1207BW heat and wet scrubber system provides superior performance and easy maintenance. The system offers built in, reduced footprint water re-circulation system, durability of absorber kit as well as an improved wet chamber and absorber kit design. With as automated burn and wet chamber separation system, cleaning and preventive maintenance is easily performed.


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  • MAT502W

    The MAT502W gas scrubbler system is designed to remove or reduce substantially the hazard presented by some gases used during semiconductors manufacturing process. To achieve this, the scrubber captures the gases via water dissolution for water-soluble gases or changes the chemical composition of them through reaction with water especially in high flow application, for each gas concentration exiting the scrubber is reduced to a level below 1/2 IDLH.


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  • MAT507BW

    The MAT507 heat and wet scrubber system provides superior performance and easy maintenance. The system offers built in, reduced footprint water re-circulation system, durability of absorber kit as well as an improved wet chamber and absorber kit design. With an automated burn and wet chamber separation system, cleaning and preventive maintenance is easily performed.


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  • Measuring Microscope

    New series of innovative and measuring microscopes designed for industrial measurement and image analysis. They integrate key performance features to ensure and guarantee the accuracy in demanding industrial environments. This system also also able to integrate into E-Max software, U-DP software and DP-E1 data processor for metrology applications.


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  • Metal Consumable Parts

    We menufacture and refurbish kernel (metal) parts for pre-process of semiconductor. We supply high level engineered technical products which can withstand complicated process conditions (high pressure, high temperature and toxic gas).


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  • MFM310

    The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultra thin single-layer films to multilayer stacks.


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  • Mini Stepper

    Nikon Engineering expand the MEMS Stepper product line to satisfy the unique Photolithgraphy requirements of Air Bearing Surface (ABS) fabrication for magnetic heads, Micro Emitting Diodes (LED), as well as optoelectronics, discrete semiconductors and crystal oscillator manufacturing. Those specialized Nikon lithgraphy solutions deliver maximum stepper yield at the lowest possible cost.


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  • MP2100

    Specially designed for Wafer Die, Crack/Edge Chip detection, surface measurements and analysis. It can be used as a production tool for inline quality inspection as well as a research and development tool for establishing standards and researching tolerances.


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  • MPT1000

    The MPT1000 utilizes a sophisticated non-contact measurement technology with a focused laser sport on the wafer surfaces. Users can measure structured taped wafers after the backgrind or dicing. This advance wafer measurement system has the capability of measuring both thickness and roughness within the same tool.


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  • MX 20x Series

    The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.


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  • MX 30x Series

    The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.


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  • Non Contact 3D Surface Profiler

    Nikon BW series is a perfect solution for surface analysis using white light interferometry technology (also known as Two Beam Interferometry). It covers wide range of application, from rough surface to smooth surface and offers highest Z resolution 3D analysis, able to achieve up to 1pm resolution. 2 types of camera: High quality (BW-S) and high speed (BW-D). Nikon BW is available in manual operation or fully automated and programmable system.


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  • Perfluoroelastomer O-Ring

    Our Perfluoroelastomer is manufactured to be used in extreme chemical and temperature services. Our parts provide the sealing capability of rubber in many chemical processes such as Semiconductor, chemical processing, analytical and process control instrments and aerospace components. Use of our parts in your equipment can improve reliability, reduce maintenance costs, and provide high purity.


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  • Plant Engineering Service

    We have unique know-how in designing, installation of the Utility Line area which is essential to the Semiconductor, Display & Specialty Chemistry, etc. It performs state of the art technology as a reliable contractor in the world leading Display/Semiconductor fields.


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  • Plasma Etch & Cleaning Machine

    SCI Automation (SCI) is a leading manufacturer of plasma cleaning and surface treatment equipment in the global. SCI, with its cleaning business for over 15 years with experience in the area of advanced semiconductor packaging and assembly. Be it inline, standalone, strip by strip or batch, SCI provided a wide range of standard or customized solution for plasma and vacuum process requirement.


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  • Pogo Pin Insertion System - NIM1100

    NIM1100 designed to perform pogo pins insertion process. Basically, it consists of 4 modules which are the singulator module, orientation checker module, buffer module and nozzle module. It's equipped with a dual camera system for more efficient calibration, double purge features to reduce pin missing and false nozzle jam alarm. The system consists of key lock switch to disable the start and reset buttons function for safety purpose when the user is away from the machine.

     


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  • Portable Scanner & 3D Printer

    Geomagic Capture is a powerful turnkey 3D scanner that enables fast inspection and reverse engineering. Small yet powerful system that used the power of blue LED structured light for accurate scanning. Compact and portable system, fits easily in a suitcase for travel convenience. All scan artwork can be print from 3D printer as total reserve engineering solution.


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  • Post Probing Inspection System - WIS8000

    WIS8000 designed to handle 8" and 12" wafer for visual inspection using high power metallurgical microscope. Wafer carrier type: 12" FOSB, 12" FOUP and 8" SEMI standard open cassette (SEMI standard). System equipped with 2 FOUP load ports, macro and micro inspection  together with wafer mapping system. Clean room ATM robot integrated with single Fork-type aluminum end effector to hold wafer at its back surface by vacuum suction.


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  • Precision Tilt Sensing System - PTS-800

    PTS-800 is a single axis high resolution precision tilt measurement system that measures inclination of any moving platform or stages within a system. Measurements can be made either absolute (one sensor) or relative (paired sensors). PTS-800 comes with a user friendly GUI and the simplicity of a USB plug-and-play connection. It comes with high accuracy and outstanding repeatability, insensitive to vibration and excellent shock durability. It is also suitable for wet process.


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  • PTR1102

    PTR1102 BONDING TESTER is a sample and robust equipment for wire pull test and die shear test. RHESCA has many equipment installed in Japanese enterprises and their overseas facilities.


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