Semiconductor

  • VUE 400

    Vue 400-P imaging power surpasses modern standards, delivering premium FA Lab features to semi conductor facilities.


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  • Wafer Autoloader

    Nikon‘s newest and most sophisticated wafer loader for IC inspection microscopes. Supports macro inspection and a range of illumination system. Nikon’s proprietary technology also ensures reliable loading of ultra-thin 100µm wafers. In addition of pattern side macro inspections of all areas, macro inspection of the back side periphery and back side centre are supported as standard. Supported wafer size from 4”, 6”, 8” and 12” wafer.


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  • Wafer ID Labeling System - DHS8000

    The main purpose of DHS8000 system design is to replace labour force and reduce the faulty that might occur during the process of placing the sticker label (wafer id) on frame wafer by the user. DHS8000 consists of 2 main parts as it's function which is OCR reader and barcode printer. The wafer ID printed on the wafer will be read by OCR. The system will then convert the wafer ID into barcode format and printed it on a sticker label and place it on the wafer tape.


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  • Wafer Mounter

    Thin wafer handling capability of Teikoku Wafer Mounting equipment are top performers in the industry. With the option of thin wafer handling, special end effector, range of thin, ultra thin and warped wafers is a major plus for our tools.


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  • Wafer Sorting System - WHS8000

    WHS8000 is designed with 2 load ports and is upgradeable to 3. It is configurable to handle 300mm wafer in FOUP or FOSB, and 200mm wafer in the open cassette without conversion. The optional OCR vision system will read the wafer ID and communicate with the host computer for its sorting destination. Alternatively, there are other direct sorting methods which are programmable by the user. This machine uses Rθ robotic arm to ensure fast and precise handling.


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  • WDA-3650

    The WDA-3650 X-ray fluorescence spectrometer for thin eveluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film composition, and element concentration with new functions and a low-COO design.


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  • Welded Metal Bellows

    We supply and refurbish semiconductor tool's key components such as valves, bellows and heaters through continuously research and development. Our bellow are certified OPM for major OEM valves and Thinfilm heater makers in the industry.


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  • X-ray Inspection System

    Nikon manufactures X-ray and Computed Tomography (CT) inspection systems to get the inside picture of complex industrial parts, by looking into the internal structure. The CT capability is used to qualify and quantify any inner or outer dimension in a smooth and non-destructive process. All models are using micro focus, and open tube source, and Nikon is the only company produce the 320kV and above microfocus X-ray source.


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  • Zirco Blast Deflash Media

    Zirco Blast Deflash Media is designed specifically for deflashing non-toxic contamination. It is reusable and works on all substrates. It is also applicable to deflash the mold residue for semiconductor discrete packages.


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