SHINHAN DIAMOND

  • Shinhan Back Grind Wheel

    With carefully selected diamond grits and bonding matrix, the Silicon Wafer Back Grinding Wheel of SHINHAN DIAMOND has achieve superior quality. Variety of pores are formed through our creative process making it possible to have grinding damage minimized. SHINHAN DIAMOND is excellent for thin wafers (<100µm). It achieves low surface damage. For normal wafer, productivity increases with good grindability, tool life and price.


    Read more...