TEIKOKU

  • De-Taper

    Teikoku De-taper is equipped with the capability to handle thin and warped wafer up to 10mm. The machine is good for high bump (300µm) wafer detaping with the special features:


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  • Laminator

    The Teikoku Tape Laminator provides two methods for cutting tapes to best match either blade cut or laser cut. Recipe controlled heat option provides tape application parameter settings for a wide variety of tape vendors. Vacuum lamination is available for NCF lamination. This works well on wafers with topography such as Flip Chip and TSV process wafer.


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  • UV Irradiator

    Teikoku UV Irradiation equipment is designed with simplicity in mind for greater MTBF and MTTR for a lower cost of ownership. The UV intensity and exposure is controlled in real time and it automatically adjusts itself by providing proper exposure dosage limits. The dosage limits can be set in recipe control.


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  • Wafer Mounter

    Thin wafer handling capability of Teikoku Wafer Mounting equipment are top performers in the industry. With the option of thin wafer handling, special end effector, range of thin, ultra thin and warped wafers is a major plus for our tools.


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