Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Inverted Metallurgical Microscope
ECLIPSE MA200
Inverted Metallurgical Microscope
ECLIPSE MA100N
More Information
More Information
Assuring you our best, always

Wafer Thickness Measurement System
MPT1000

The MPT1000 is Chapman Instruments’ latest non-contact system, providing wafer thickness measurements. It can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data for enhancing productivity. The MPT1000 utilizes a sophisticated non-contact measurement technology with a focused laser spot on the wafer surfaces. Users can measure structured taped wafers after backgrind or dicing. The powerful, user-friendly, Windows® based operational software can be programmed to provide automated wafer thickness maps, execute a series of measurements, or report the data off-line for further analysis.

Key Features
  • Non-contact, providing non-destructive thickness measurements
  • 0.1 μm thickness resolution, providing thickness uniformity and Q/C control
  • 1 μm laser spot size on both top and bottom wafer surfaces, providing the ability to distinguish between small features, e.g. bump wafers
  • Optical Measurement System, providing accurate wafer thickness measurements independent of material properties, especially useful for patterned wafers, GaAs and other wafer types, after backgrind and dicing
  • Wafer Bow and Warp measurements
Specifications
  • Thickness resolution (0.1um) providing uniform TTV for production control of wafers.
  • Measurements after back grind or dicing provides flexibility for thickness uniformity control.
  • Small focused laser spot (1 um) provides the resolution required for measuring bumped wafers and via features.
Please contact us for more information