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Manual Wafer Measurement Tools
MX 30x

Applications
  • R&D
  • In process control for ThicknessTTV

Specifications
  • Sensor:  Multiple point wafer geometry gauge
  • Wafer size:  Up to 450 mm
  • Thickness range:  From 50µm
  • Accuracy:  1µm
  • Resolution:  0.1µm
  • Loading:  With or without Robots Handling point
Please contact us for more information