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TXRF 310
TXRF Wafer Surface Contamination 

TXRF analysis can gauge contamination in all processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from through U with a single-target, 3-beam X-ray system and a solid-state detector system.

The TXRF-310 includes Rigaku's patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation.
The optional Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots" that can be automatically re-measured at higher precision.

Optional ZEE-TXRF capability overcomes the historical 15mm edge exclusion of original TXRF designs, enabling measurements to be made with zero edge exclusion. The optional BAC-TXRF capability enables fully-automated front-side and TXRF measurements of 300mm wafers with non-contacting wafer flipping.

Key benefits
  • Quick contamination inspection for semiconductor processes
  • Accepts 300 mm, 200 mm, and 150 mm wafers
  • Wide range of analytical elements (Na~U)
  • Light-element sensitivity (for Na, Mg, and Al)
  • Single target 3-beam method and XYθ stage are unique to Rigaku, enabling highly -trace analysis over the entire wafer surface
  • Import measurement coordinates from defect inspection tools for follow-up analysis
  • FOUP, SMIF, and through-the-wall configurations are available to meet the various needs of high-volume manufacturing wafer fabs
Specs & Applications
  • Size of wafer: 300 mm, 200 mm, and 150 mm
  • Rotating-anode X-ray source
  • Sample stage: XY θ stage
  • Solid-state detector
  • Oil-free electrical transformer
  • Three-beam excitation
  • Automatic optics alignment
  • Data import from external surface defect inspection tool
Please contact us for more information